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GLP3/MTC3 bonding system
Thermal bonding systems, ensure safe and homogeneous bonding of baking lacquer wires within an electrical winding.
The baking systems can be expanded with a complete test system to check the quality before and after baking
Thermal caking systems GLP3 and MTC3
With heat generated by electricity, the copper windings are heated to the melting point of the bonding layer. When the correct temperature is reached and the winding cools, the wires are firmly bonded together.
This ensures that the winding becomes one solid whole. This process is controlled and monitored by a PC in the bonding system.
The duration of heating depends on the current, the dimensions of the winding and the stator. By adjusting the current, thermal brazing processes can last between 1 and 300 seconds. The aim is to get a uniform temperature so that the bonding is equally strong everywhere.
Multiple thermal firing processes are available for different applications to precisely control heating and always achieve optimal results.
Besides being used at single stations, our bonding systems are also perfectly suited for integration into fully automated production lines.
As a system supplier, we are able to supply the complete mechanics, which may consist of single bonding stations, a rotary indexing table or even a complete production line, in addition to the electric bonding machine itself.
Only the combination of these matched components ensures the best possible production result.
Naturally, moulding tools are also part of our product range.
In addition, our bonding systems can be expanded with our MTC3 status testers, which allow you to obtain detailed information on the quality of your product before and after baking.
Reliable. Easy to configure. Reproducible. Highest precision
Electrical connection of coils
DC connectors
AC junction boxes for 3-phase windings
Up to 100 kW
Up to 1000 A
Up to 1000 V
Different heating methods
Constant voltage
Constant current
Constant temperature
Temperature profile
- Bonding with current densities up to 200A/mm2
- Monitoring of temperature development during the baking process
- Kelvin resistance measurement (4-wire technology)
- Online temperature monitoring
- Dynamic overcurrent sensor and fast shutdown
- Monitoring of integrated sensors such as temperature sensors.
The MTC3 bracing system can also be combined with numerous other measurements:
- Surgetest
- Partial discharge measurement
- High voltage test
- Rotational direction measurement
- Insulation resistance measurement
- Integration into test systems – the baking process is performed as an additional test step.
- Integration in automatic production lines
Gijsbert at IONIO is here to help you.
At IONIO, we not only supply advanced testing and measurement systems, but also offer clear and expert advice to optimise the testing of your product. Discover how we can improve your business processes.rnA consultation can be scheduled in no time!
